Name: VTUSD064GCCAMTLE
Brand: Viking Technology
SKU: DS-6471941
Availability: InStock
Rating: 4.8 (3 reviews)

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Viking Technology VTUSD064GCCAMTLE

MEM CARD MICROSDHC 64GB CL10 MLC

Manufacturer # :VTUSD064GCCAMTLE

Manufacturer :Viking Technology

Dasenic # :VTUSD064GCCAMTLE-DS

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VTUSD064GCCAMTLE Datasheet

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Description : MEM CARD MICROSDHC 64GB CL10 MLC

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In Stock: 36

MOQ :1 PCS

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Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

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Unit Price :$ 0

Total :$ 0.00

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VTUSD064GCCAMTLE information

Viking Technology VTUSD064GCCAMTLE technical specifications, attributes, parameters.
Category:Memory Cards & Modules/Memory Cards
Product Status:Obsolete
Operating Temperature:-25°C ~ 85°C
Technology:MLC
Memory Size:64GB
Memory Type:microSDHC™
Speed:Class 10
MSL Rating:1 (Unlimited, 30°C/85%RH)
US ECCN:3A991B1A
HTS US:8523.51.0000
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Viking Technology VTUSD064GCCAMTLE
Datasheet:
VTUSD064GCCAMTLE,

Viking Technology VTUSD064GCCAMTLE Environmental and export classification status description

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

VTUSD064GCCAMTLE provided by Viking Technology

Viking Technology, a product division of Sanmina Corporation, is a global technology leader in the field of DRAM memory & Flash storage solutions ranging from high-performance computing SSDs to small form factor flash DRAM modules optimized for industrial, telecommunications, military/defense, and enterprise markets. Viking Technology broadens its technology leadership with several advanced technologies such as memory packaging, multi-chip packaging, system-in-package, and storage class memory.