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Vicor Corporation PI2211-00-QAIG
IC HOT SWAP CTRLR GP 24QFN
Manufacturer # :PI2211-00-QAIG
Manufacturer :Vicor Corporation
Dasenic # :PI2211-00-QAIG-DS
Datasheet :
PI2211-00-QAIG Datasheet
PI2211-00-QAIG DatasheetCustomer # :
Description : IC HOT SWAP CTRLR GP 24QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 5.8999 | $ 59 |
| 3000+ | $ 3.2777 | $ 9833.1 |
| 6000+ | $ 3.1544 | $ 18926.4 |
In Stock: 53
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.8999
Total :$ 5.90
Delivery :
Payment :
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PI2211-00-QAIG information
Vicor Corporation PI2211-00-QAIG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C
- Features:Auto Retry, Thermal Limit
- Mounting Type:Surface Mount
- Package / Case:24-VFQFN Exposed Pad
- Current - Supply:12 mA
- Type:Hot Swap Controller
- Number of Channels:1
- Supplier Device Package:24-QFN (4x4)
- Internal Switch(s):No
- Voltage - Supply:900mV ~ 14V
- Programmable Features:Circuit Breaker, Current Limit, Fault Timeout, OVP, UVLO
- Current - Output ( Max):-
- Applications:General Purpose
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
PI2211-00-QAIG provided by Vicor Corporation
Vicor Corporation is the leader in high-performance power modules, enabling customer innovation with easy-to-deploy modular power system solutions for power delivery networks that provide the highest density and efficiency from source to point-of-load. We continuously advance the density, efficiency and power delivery capabilities of our power modules by staying on the forefront of distribution architectures, conversion topologies and packaging technology. Vicor serves customers in enterprise and high-performance computing, industrial equipment and automation, robotics, UAVs, vehicles and transportation, satellites, and aerospace and defense.
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