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Vesper Technologies Inc. VA1200AA

Name: VA1200AA
Brand: Vesper Technologies Inc.
SKU: VA1200AA-DS
Price: 3.9330 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 6521

MOQ: 1

5 Price Tiers

Mfr.Part # :VA1200AA
Manufacturer :Vesper Technologies Inc.
Dasenic # :VA1200AA-DS
Datasheet : VA1200AA Datasheet PDF
Description : BONE CONDUCTOR SENSOR ACCELEROME
Package :-
Unit Price: $3.9330
Total: $3.93

Quantity	Unit Price	You Save
1-1	$3.9330	-
2-10	$3.2049	18.5% save
11-25	$2.9542	24.9% save
26-50	$2.7781	29.4% save
51-100	$2.6129	33.6% save

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Vesper Technologies Inc. VA1200AA technical specifications, attributes, parameters.

Category:Audio Components/Microphones

Product Status:Active

Voltage - Rated:1.8 V

Ratings:-

Size / Dimension:0.114" L x 0.108" W (2.90mm x 2.76mm)

Voltage Range:-

Current - Supply:160 µA

Port Location:-

Termination:Solder Pads

Type:Piezo MEMS

Impedance:400 Ohms

Output Type:Analog

Direction:-

Frequency Range:-

Sensitivity:-43dB

S/ N Ratio:-

Height ( Max):0.035" (0.90mm)

Shape:Rectangle

EU RoHS Status:ROHS3 Compliant

MSL Rating:1 (Unlimited, 30°C/85%RH)

REACH Status:REACH Unaffected

US ECCN:EAR99

HTS US:8542.39.0001

China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

VA1200AA provided by Vesper Technologies Inc.

Vesper,the world’s most advanced acoustic sensors.With roots at the University of Michigan and initial funding from National Aeronautics and Space Administration (NASA), National Institutes of Health (NIH) and National Science Foundation (NSF), Vesper’s leadership team has is one of the most experienced in the MEMS industry. Based in Boston, MA, the company is privately held and is funded by Accomplice, AAC Technologies, XinGang Electronics, Hyperplane and strategic partners.Vesper’s mission is to dramatically improve the reliability of the voice user interface for smart speakers, connected automobiles, smartphones and any connected device using our proprietary piezoelectric MEMS technology invented by our founders at the University of Michigan.