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Toshiba Semiconductor and Storage TLP701H(TP,F)
Manufacturer # :TLP701H(TP,F)
Manufacturer :Toshiba Semiconductor and Storage
Dasenic # :TLP701H(TP,F)-DS
Datasheet : TLP701H(TP,F) Datasheet
Customer # :
Description : X36 PB-F PHOTOCOUPLER SMD BULK J
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In Stock: 19496
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6522
Total :$ 0.65
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TLP701H(TP,F) information
Toshiba Semiconductor and Storage TLP701H(TP,F) technical specifications, attributes, parameters.
- Category:Isolators/Optoisolators - Logic Output
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:6-SOIC (0.268", 6.80mm Width)
- Input Type:DC
- Output Type:Push-Pull, Totem Pole
- Number of Channels:1
- Supplier Device Package:6-SDIP
- Voltage - Supply:10V ~ 30V
- Data Rate:-
- Current - Output / Channel:600 mA
- Voltage - Isolation:5000Vrms
- Rise / Fall Time ( Typ):50ns, 50ns
- Inputs - Side 1/ Side 2:1/0
- Common Mode Transient Immunity ( Min):20kV/µs
- Propagation Delay tp L H / tp H L ( Max):700ns, 700ns
- Voltage - Forward ( Vf) ( Typ):1.57V
- Current - D C Forward ( If) ( Max):25mA
- EU RoHS Status:RoHS Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8541.49.8000
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TLP701H(TP,F) provided by Toshiba Semiconductor and Storage
Toshiba America Electronic Components, Inc. (TAEC) is the North America electronic components business of Toshiba. TAEC offers a broad IC and discrete product line including high-end microcontrollers, ASICs and ASSPs for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions as well as storage products including Enterprise and Consumer HDDs.TAEC was established in 1989, providing design, manufacturing, marketing and sales, with offices in United States and Latin America.
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