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Toshiba Semiconductor and Storage TLP187(TPR,E
Manufacturer # :TLP187(TPR,E
Manufacturer :Toshiba Semiconductor and Storage
Dasenic # :TLP187(TPR,E-DS
Datasheet : TLP187(TPR,E Datasheet
Customer # :
Description : X36 PB-F PHOTOCOUPLER ROHS SO6 T
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In Stock: 21285
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5866
Total :$ 0.59
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TLP187(TPR,E information
Toshiba Semiconductor and Storage TLP187(TPR,E technical specifications, attributes, parameters.
- Category:Isolators/Optoisolators - Transistor, Photovoltaic Output
- Product Status:Active
- Operating Temperature:-55°C ~ 110°C
- Mounting Type:Surface Mount
- Package / Case:6-SOIC (0.173", 4.40mm Width), 4 Leads
- Input Type:DC
- Output Type:Darlington
- Number of Channels:1
- Supplier Device Package:6-SOP
- Current - Output / Channel:150mA
- Voltage - Isolation:3750Vrms
- Rise / Fall Time ( Typ):40µs, 15µs
- Voltage - Output ( Max):300V
- Voltage - Forward ( Vf) ( Typ):1.25V
- Current - D C Forward ( If) ( Max):50 mA
- Current Transfer Ratio ( Min):1000% @ 1mA
- Current Transfer Ratio ( Max):-
- Turn On / Turn Off Time ( Typ):50µs, 15µs
- Vce Saturation ( Max):1.2V
- EU RoHS Status:RoHS Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8541.49.8000
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLP187(TPR,E provided by Toshiba Semiconductor and Storage
Toshiba America Electronic Components, Inc. (TAEC) is the North America electronic components business of Toshiba. TAEC offers a broad IC and discrete product line including high-end microcontrollers, ASICs and ASSPs for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions as well as storage products including Enterprise and Consumer HDDs.TAEC was established in 1989, providing design, manufacturing, marketing and sales, with offices in United States and Latin America.
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