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Toshiba Semiconductor and Storage 74HC4052D
Manufacturer # :74HC4052D
Manufacturer :Toshiba Semiconductor and Storage
Dasenic # :74HC4052D-DS
Datasheet : 74HC4052D Datasheet
Customer # :
Description : IC MUX 2 X 4:1 4 OHM 16SOIC
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In Stock: 45542
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.1123
Total :$ 0.11
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74HC4052D information
Toshiba Semiconductor and Storage 74HC4052D technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Analog Switches, Multiplexers, Demultiplexers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package:16-SOIC
- Number of Circuits:2
- Multiplexer/ Demultiplexer Circuit:4:1
- Switch Circuit:SP4T
- On- State Resistance ( Max):130Ohm
- Voltage - Supply, Single ( V+):2V ~ 6V
- Voltage - Supply, Dual ( V±):-
- -3db Bandwidth:-
- Channel-to- Channel Matching (Δ Ron):4Ohm
- Switch Time ( Ton, Toff) ( Max):34ns, 32ns
- Charge Injection:-
- Channel Capacitance ( C S(off), C D(off)):10pF
- Current - Leakage ( I S(off)) ( Max):1µA
- Crosstalk:-50dB @ 1MHz
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
74HC4052D provided by Toshiba Semiconductor and Storage
Toshiba America Electronic Components, Inc. (TAEC) is the North America electronic components business of Toshiba. TAEC offers a broad IC and discrete product line including high-end microcontrollers, ASICs and ASSPs for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions as well as storage products including Enterprise and Consumer HDDs.TAEC was established in 1989, providing design, manufacturing, marketing and sales, with offices in United States and Latin America.
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