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Texas Instruments XTR111AIDGQTG4
Manufacturer # :XTR111AIDGQTG4
Manufacturer :Texas Instruments
Dasenic # :XTR111AIDGQTG4-DS
Datasheet : XTR111AIDGQTG4 Datasheet
Customer # :
Description : IC PREC VOLT-CURR CONV/TX 10MSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 697
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.855
Total :$ 2.85
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XTR111AIDGQTG4 information
Texas Instruments XTR111AIDGQTG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Sensor and Detector Interfaces
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:10-PowerTFSOP, 10-MSOP (0.118", 3.00mm Width)
- Input Type:Voltage
- Current - Supply:550 µA
- Type:Current Transmitter
- Output Type:Voltage
- Supplier Device Package:10-HVSSOP
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
XTR111AIDGQTG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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