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Texas Instruments XIO3130NMH
INTEGRATED PCI EXPRESS (PCI
Manufacturer # :XIO3130NMH
Manufacturer :Texas Instruments
Dasenic # :XIO3130NMH-DS
Datasheet :
XIO3130NMH Datasheet
XIO3130NMH DatasheetCustomer # :
Description : INTEGRATED PCI EXPRESS (PCI
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 126+ | $ 27.8883 | $ 3513.93 |
In Stock: 819
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 27.8883
Total :$ 27.89
Delivery :
Payment :
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XIO3130NMH information
Texas Instruments XIO3130NMH technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Specialized
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:196-LBGA
- Interface:PCI Express
- Supplier Device Package:196-NFBGA (15x15)
- Voltage - Supply:1.35V ~ 1.65V, 3V ~ 3.6V
- Applications:PCI-to-PCI Bridge
- EU RoHS Status:Vendor omitted MSL Rating information
- MSL Rating:3 (168 Hours,30°C/60%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
XIO3130NMH provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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