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Texas Instruments XIO3130INMH
Manufacturer # :XIO3130INMH
Manufacturer :Texas Instruments
Dasenic # :XIO3130INMH-DS
Datasheet : XIO3130INMH Datasheet
Customer # :
Description : INTEGRATED PCI EXPRESS (PCI
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 597
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 32.0732
Total :$ 32.07
Delivery :
Payment :
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XIO3130INMH information
Texas Instruments XIO3130INMH technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Specialized
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:196-LBGA
- Interface:PCI Express
- Supplier Device Package:196-NFBGA (15x15)
- Voltage - Supply:1.35V ~ 1.65V, 3V ~ 3.6V
- Applications:PCI-to-PCI Bridge
- EU RoHS Status:Vendor omitted MSL Rating information
- MSL Rating:3 (168 Hours,30°C/60%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
XIO3130INMH provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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