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  • Texas Instruments WL1835MODGBMOCR

    WiLink™ 8 single band combo 2x2 MIMO Wi-Fi®, Bluetooth® & Bluetooth Smart module
  • part number has RoHS
  • Mfr.Part # :WL1835MODGBMOCR
  • Manufacturer :Texas Instruments
  • Dasenic # :WL1835MODGBMOCR-DS
  • Datasheet :pdf download WL1835MODGBMOCR Datasheet
  • Description : WiLink™ 8 single band combo 2x2 MIMO Wi-Fi®, Bluetooth® & Bluetooth Smart module
  • Package :-
  • Quantity :
    Unit Price : $ 14.679Total : $ 14.68
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 5823
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 14.6790$ 14.68
10 +$ 13.5450$ 135.45
25 +$ 12.7710$ 319.28
100 +$ 12.2040$ 1220.40
250 +$ 11.5290$ 2882.25

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Texas Instruments WL1835MODGBMOCR technical specifications, attributes, parameters.
Category:RF and Wireless/RF Transceiver Modules and Modems
Product Status:Active
Frequency:2.4GHz
Sensitivity:-96.3dBm
Protocol:802.11b/g/n, Bluetooth 4.2
Modulation:CCK, DSSS, GFSK, OFDM
Series:WiLink™
Operating Temperature:-20°C ~ 70°C
Voltage- Supply:2.9V ~ 4.8V
Data Rate:54Mbps
Serial Interfaces:SDIO, UART
R F Family/ Standard:Bluetooth, WiFi
Power- Output:17.3dBm
Current- Receiving:49mA ~ 85mA
Current- Transmitting:238mA ~ 420mA
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
WL1835MODGBMOCR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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