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Texas Instruments VSP8133RSKR

IC VIDEO FRONT END 64VQFN
part number has RoHS
Manufacturer # :VSP8133RSKR
Manufacturer :Texas Instruments
Dasenic # :VSP8133RSKR-DS
Customer # :
Description : IC VIDEO FRONT END 64VQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 37.7370$ 377.37
2000+$ 25.1580$ 50316
In Stock: 2748
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 37.737
Total :$ 37.74
Delivery :
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Payment :
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VSP8133RSKR information

  • Texas Instruments VSP8133RSKR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Video Processing
  • Product Status:Discontinued at Digi-Key
  • Mounting Type:Surface Mount
  • Package / Case:64-VFQFN Exposed Pad
  • Supplier Device Package:64-VQFN (8x8)
  • Standards:-
  • Voltage - Supply:1.5V ~ 3.6V
  • Control Interface:I²C
  • Applications:Professional Video
  • Function:Generator
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
VSP8133RSKR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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