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Texas Instruments ULN2803ADWR

TRANS 8NPN DARL 50V 0.5A 18SO
part number has RoHS
Manufacturer # :ULN2803ADWR
Manufacturer :Texas Instruments
Dasenic # :ULN2803ADWR-DS
Customer # :
Description : TRANS 8NPN DARL 50V 0.5A 18SO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.4650$ 3.47
100+$ 2.5920$ 259.2
1000+$ 2.2500$ 2250
In Stock: 14832
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.465
Total :$ 3.46
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ULN2803ADWR information

  • Texas Instruments ULN2803ADWR technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Arrays
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:18-SOIC (0.295", 7.50mm Width)
  • Power - Max:-
  • Supplier Device Package:18-SOIC
  • Transistor Type:8 NPN Darlington
  • Current - Collector ( Ic) ( Max):500mA
  • Voltage - Collector Emitter Breakdown ( Max):50V
  • Vce Saturation ( Max) @ Ib, Ic:1.6V @ 500µA, 350mA
  • Current - Collector Cutoff ( Max):-
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:-
  • Frequency - Transition:-
  • EU RoHS Status:RoHS3(EU 2015/863)
  • REACH Status:REACH is not affected
  • MSL Rating:2 (1 Year, 30C/60%RH)
  • HTSUS:8541.29.0095
  • US ECCN:EAR99
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ULN2803ADWR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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