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Texas Instruments ULN2803ADW-P
Manufacturer # :ULN2803ADW-P
Manufacturer :Texas Instruments
Dasenic # :ULN2803ADW-P-DS
Datasheet : ULN2803ADW-P Datasheet
Customer # :
Description : IC
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In Stock: 23880
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.3879
Total :$ 3.39
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ULN2803ADW-P information
Texas Instruments ULN2803ADW-P technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Arrays
- Product Status:Last Time Buy
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:18-SOIC (0.295", 7.50mm Width)
- Power - Max:-
- Supplier Device Package:18-SOIC
- Transistor Type:8 NPN Darlington
- Current - Collector ( Ic) ( Max):500mA
- Voltage - Collector Emitter Breakdown ( Max):50V
- Vce Saturation ( Max) @ Ib, Ic:1.6V @ 500µA, 350mA
- Current - Collector Cutoff ( Max):50µA
- D C Current Gain (h F E) ( Min) @ Ic, Vce:-
- Frequency - Transition:-
- EU RoHS Status:ROHS3 Compliant
- US ECCN:EAR99
- HTS US:8541.29.0095
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ULN2803ADW-P provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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