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Texas Instruments UCC5350MCDWVR
Manufacturer # :UCC5350MCDWVR
Manufacturer :Texas Instruments
Dasenic # :UCC5350MCDWVR-DS
Datasheet : UCC5350MCDWVR Datasheet
Customer # :
Description : IC ISOLATION
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In Stock: 22214
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.3028
Total :$ 1.30
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UCC5350MCDWVR information
Texas Instruments UCC5350MCDWVR technical specifications, attributes, parameters.
- Category:Isolators/Isolator Gate Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.295", 7.50mm Width)
- Technology:Capacitive Coupling
- Approval Agency:CQC, UL, VDE
- Number of Channels:1
- Supplier Device Package:8-SOIC
- Current - Output High, Low:5A, 5A
- Voltage - Isolation:5000Vrms
- Current - Peak Output:-
- Rise / Fall Time ( Typ):10ns, 10ns
- Common Mode Transient Immunity ( Min):100kV/µs
- Propagation Delay tp L H / tp H L ( Max):100ns, 100ns
- Pulse Width Distortion ( Max):20ns
- Voltage - Forward ( Vf) ( Typ):-
- Current - D C Forward ( If) ( Max):-
- Voltage - Output Supply:13.2V ~ 33V
- EU RoHS Status:Vendor omitted MSL Rating information
- MSL Rating:2 (1 Year,30°C/60%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC5350MCDWVR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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