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Texas Instruments UCC3917NG4
IC HOT SWAP CTRLR GP 16DIP
Manufacturer # :UCC3917NG4
Manufacturer :Texas Instruments
Dasenic # :UCC3917NG4-DS
Datasheet :
UCC3917NG4 Datasheet
UCC3917NG4 DatasheetCustomer # :
Description : IC HOT SWAP CTRLR GP 16DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 5.1379 | $ 5.14 |
| 10+ | $ 4.8470 | $ 48.47 |
| 100+ | $ 4.5727 | $ 457.27 |
| 1000+ | $ 4.0697 | $ 4069.7 |
In Stock: 7536
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.1379
Total :$ 5.14
Delivery :
Payment :
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UCC3917NG4 information
Texas Instruments UCC3917NG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Features:UVLO
- Mounting Type:Through Hole
- Package / Case:16-DIP (0.300", 7.62mm)
- Current - Supply:5 mA
- Type:Hot Swap Controller
- Number of Channels:1
- Supplier Device Package:16-PDIP
- Internal Switch(s):No
- Voltage - Supply:15V ~ 1000V
- Programmable Features:Auto Retry, Circuit Breaker, Current Limit, Fault Timeout, Latched Fault
- Current - Output ( Max):-
- Applications:General Purpose
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
UCC3917NG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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