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Texas Instruments UCC3915DP
Manufacturer # :UCC3915DP
Manufacturer :Texas Instruments
Dasenic # :UCC3915DP-DS
Datasheet : UCC3915DP Datasheet
Customer # :
Description : IC HOT SWAP CTRLR GP 16SOIC
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In Stock: 8661
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.861
Total :$ 3.86
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Payment :
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UCC3915DP information
Texas Instruments UCC3915DP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Features:Thermal Limit
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width)
- Current - Supply:1 mA
- Type:Hot Swap Controller
- Number of Channels:1
- Supplier Device Package:16-SOIC
- Internal Switch(s):Yes
- Voltage - Supply:7V ~ 15V
- Programmable Features:Circuit Breaker, Current Limit, Fault Timeout
- Current - Output ( Max):4A
- Applications:General Purpose
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC3915DP provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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