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Texas Instruments UCC28083DG4
IC OFFLINE SW PUSH-PULL 8SOIC
Manufacturer # :UCC28083DG4
Manufacturer :Texas Instruments
Dasenic # :UCC28083DG4-DS
Datasheet :
UCC28083DG4 Datasheet
UCC28083DG4 DatasheetCustomer # :
Description : IC OFFLINE SW PUSH-PULL 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 225+ | $ 3.9944 | $ 898.74 |
In Stock: 2848
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.9944
Total :$ 3.99
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Payment :
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UCC28083DG4 information
Texas Instruments UCC28083DG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - AC DC Converters, Offline Switchers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package:8-SOIC
- Voltage - Breakdown:-
- Power ( Watts):-
- Internal Switch(s):No
- Voltage - Supply ( Vcc/ Vdd):8.3V ~ 15V
- Frequency - Switching:50kHz ~ 1MHz
- Output Isolation:Isolated
- Topology:Push-Pull
- Voltage - Start Up:12.5 V
- Duty Cycle:49%
- Fault Protection:Current Limiting
- Control Features:Frequency Control
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC28083DG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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