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  • Texas Instruments UCC2804N

    IC OFFLINE SWITCH MULT TOP 8DIP
  • part number has RoHS
  • Mfr.Part # :UCC2804N
  • Manufacturer :Texas Instruments
  • Dasenic # :UCC2804N-DS
  • Datasheet :pdf download UCC2804N Datasheet
  • Description : IC OFFLINE SWITCH MULT TOP 8DIP
  • Package :-
  • Quantity :
    Unit Price : $ 7.6Total : $ 7.60
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 1696
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 7.6000$ 7.60
10 +$ 7.0400$ 70.40
25 +$ 6.5800$ 164.50
50 +$ 6.2800$ 314.00
100 +$ 5.9000$ 590.00

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Texas Instruments UCC2804N technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/AC DC Converters, Offline Switchers
Product Status:Last Time Buy
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Through Hole
Package / Case:8-DIP (0.300", 7.62mm)
Supplier Device Package:8-PDIP
Voltage - Breakdown:-
Power ( Watts):-
Internal Switch(s):No
Voltage - Supply ( Vcc/ Vdd):8.3V ~ 12V
Frequency - Switching:Up to 1MHz
Output Isolation:-
Topology:Boost, Flyback, Forward
Voltage - Start Up:12.5 V
Duty Cycle:49%
Fault Protection:Current Limiting
Control Features:Frequency Control
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
UCC2804N provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.

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