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Texas Instruments UCC27324DGNR

IC GATE DRVR LOW-SIDE 8MSOP
part number has RoHS
Manufacturer # :UCC27324DGNR
Manufacturer :Texas Instruments
Dasenic # :UCC27324DGNR-DS
Customer # :
Description : IC GATE DRVR LOW-SIDE 8MSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.9090$ 0.91
10+$ 0.6678$ 6.68
50+$ 0.6300$ 31.5
100+$ 0.4950$ 49.5
200+$ 0.4716$ 94.32
In Stock: 10840
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.909
Total :$ 0.91
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UCC27324DGNR information

  • Texas Instruments UCC27324DGNR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Gate Drivers
  • Product Status:Active
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
  • Input Type:Non-Inverting
  • Supplier Device Package:8-HVSSOP
  • Voltage - Supply:4.5V ~ 15V
  • Channel Type:Independent
  • Driven Configuration:Low-Side
  • Number of Drivers:2
  • Gate Type:N-Channel, P-Channel MOSFET
  • Logic Voltage - V I L, V I H:1V, 2V
  • Current - Peak Output ( Source, Sink):4A, 4A
  • High Side Voltage - Max ( Bootstrap):-
  • Rise / Fall Time ( Typ):20ns, 15ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC27324DGNR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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