Name: UCC27200ADRMR
Brand: Texas Instruments
SKU: DS-6131051
Price: 1.584 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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1 : $1.5840

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Texas Instruments UCC27200ADRMR

IC GATE DRVR HALF-BRIDGE 8VSON

Manufacturer # :UCC27200ADRMR

Manufacturer :Texas Instruments

Dasenic # :UCC27200ADRMR-DS

Datasheet :

UCC27200ADRMR Datasheet

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Description : IC GATE DRVR HALF-BRIDGE 8VSON

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Quantity	Unit Price	Total
1+	$ 1.5840	$ 1.58
10+	$ 1.4220	$ 14.22
100+	$ 1.2150	$ 121.5
250+	$ 1.1430	$ 285.75
500+	$ 0.9990	$ 499.5

In Stock: 9084

MOQ :1 PCS

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Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

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Unit Price :$ 1.584

Total :$ 1.58

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UCC27200ADRMR information

Texas Instruments UCC27200ADRMR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/PMIC - Gate Drivers
Product Status:Active
Operating Temperature:-40°C ~ 140°C (TJ)
Mounting Type:Surface Mount
Package / Case:8-VDFN Exposed Pad
Input Type:Non-Inverting
Supplier Device Package:8-VSON (4x4)
Voltage - Supply:8V ~ 17V
Channel Type:Independent
Driven Configuration:Half-Bridge
Number of Drivers:2
Gate Type:N-Channel MOSFET
Logic Voltage - V I L, V I H:3V, 8V
Current - Peak Output ( Source, Sink):3A, 3A
High Side Voltage - Max ( Bootstrap):120 V
Rise / Fall Time ( Typ):8ns, 7ns
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Texas Instruments UCC27200ADRMR
Datasheet:
UCC27200ADRMR,

Texas Instruments UCC27200ADRMR Environmental and export classification status description
The Texas Instruments UCC27200ADRMR is a high-speed, high-voltage, high-side and low-side gate driver IC, designed for driving MOSFETs and IGBTs in applications such as switched-mode power supplies, motor control, and other power electronics systems. Functions: - High-speed gate driving for both high-side and low-side power switches - Drives N-channel MOSFETs and IGBTs with split outputs - Active Miller clamp for fast turn-off of the power switch - Adjustable dead time for preventing shoot-through in half-bridge configurations - Under-voltage lockout protection Applications: - Switched-mode power supplies (SMPS) - Motor drives - Uninterruptible power supplies (UPS) - Solar inverters - Industrial drives Alternative Components: - Infineon Technologies' IRS212x series - Maxim Integrated's MAX22700/MAX22702 - STMicroelectronics' STLUX385A Embedded Modules: - Built-in under-voltage lockout (UVLO) function - Integrated active Miller clamp - Adjustable dead-time generator - Over-temperature protection Related Q&A: 1. Can the UCC27200ADRMR drive power MOSFETs and IGBTs simultaneously? 2. How does the active Miller clamp function help in switch-off timings? 3. What are the key benefits of using the UCC27200ADRMR in motor control applications? 4. Can the dead time be adjusted dynamically in real-time applications? 5. Are there any design considerations to keep in mind when using the UCC27200ADRMR in high-speed switching applications?

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UCC27200ADRMR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.