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Texas Instruments UCC25630-3DDBT
Manufacturer # :UCC25630-3DDBT
Manufacturer :Texas Instruments
Dasenic # :UCC25630-3DDBT-DS
Datasheet : UCC25630-3DDBT Datasheet
Customer # :
Description : HALF BRIDGE CONT WITH HV DRIVER
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In Stock: 15797
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7641
Total :$ 0.76
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UCC25630-3DDBT information
Texas Instruments UCC25630-3DDBT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - DC DC Switching Controllers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width), 14 Leads
- Output Type:Transistor Driver
- Supplier Device Package:14-SOIC
- Voltage - Supply ( Vcc/ Vdd):11.25V ~ 26V
- Frequency - Switching:35kHz ~ 1MHz
- Number of Outputs:1
- Topology:Half-Bridge
- Control Features:Hybrid Hysteretic Control (HHC)
- Output Configuration:Positive, Isolation Capable
- Output Phases:1
- Duty Cycle ( Max):50%
- Synchronous Rectifier:No
- Clock Sync:No
- Serial Interfaces:-
- Function:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC25630-3DDBT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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