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Texas Instruments UCC23513DWY
Manufacturer # :UCC23513DWY
Manufacturer :Texas Instruments
Dasenic # :UCC23513DWY-DS
Datasheet : UCC23513DWY Datasheet
Customer # :
Description : IC GATE DRVR ISOLATED
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In Stock: 40327
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6867
Total :$ 0.69
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UCC23513DWY information
Texas Instruments UCC23513DWY technical specifications, attributes, parameters.
- Category:Isolators/Isolator Gate Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:6-SOIC (0.295", 7.50mm Width)
- Technology:Capacitive Coupling
- Approval Agency:CQC, UL, VDE
- Number of Channels:1
- Supplier Device Package:6-SOIC
- Current - Output High, Low:3A, 3.5A
- Voltage - Isolation:5700Vrms
- Current - Peak Output:3A, 3.5A
- Rise / Fall Time ( Typ):28ns, 25ns (Max)
- Common Mode Transient Immunity ( Min):150kV/µs
- Propagation Delay tp L H / tp H L ( Max):105ns, 105ns
- Pulse Width Distortion ( Max):35ns
- Voltage - Forward ( Vf) ( Typ):2.1V
- Current - D C Forward ( If) ( Max):25 mA
- Voltage - Output Supply:14V ~ 33V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC23513DWY provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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