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Texas Instruments UCC23513BDWYR
Manufacturer # :UCC23513BDWYR
Manufacturer :Texas Instruments
Dasenic # :UCC23513BDWYR-DS
Datasheet : UCC23513BDWYR Datasheet
Customer # :
Description : 4-A/5-A, 5.7-KVRMS SINGLE-CHANNE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 11512
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.648
Total :$ 0.65
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UCC23513BDWYR information
Texas Instruments UCC23513BDWYR technical specifications, attributes, parameters.
- Category:Isolators/Isolator Gate Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:6-SOIC (0.295", 7.50mm Width)
- Technology:Optical Coupling
- Approval Agency:CQC, UL, VDE
- Number of Channels:1
- Supplier Device Package:6-SOIC
- Current - Output High, Low:4.5A, 5.3A
- Voltage - Isolation:5700Vrms
- Current - Peak Output:4.5A, 5.3A
- Rise / Fall Time ( Typ):28ns, 25ns (Max)
- Common Mode Transient Immunity ( Min):150kV/µs
- Propagation Delay tp L H / tp H L ( Max):105ns, 105ns
- Pulse Width Distortion ( Max):35ns
- Voltage - Forward ( Vf) ( Typ):2.1V
- Current - D C Forward ( If) ( Max):25 mA
- Voltage - Output Supply:10V ~ 33V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC23513BDWYR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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