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Texas Instruments UCC21737QDWRQ1
Manufacturer # :UCC21737QDWRQ1
Manufacturer :Texas Instruments
Dasenic # :UCC21737QDWRQ1-DS
Datasheet : UCC21737QDWRQ1 Datasheet
Customer # :
Description : Automotive 10-A isolated single-channel gate driver for SiC/IGBT, active short-circuit protection
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In Stock: 13626
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.274
Total :$ 5.27
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UCC21737QDWRQ1 information
Texas Instruments UCC21737QDWRQ1 technical specifications, attributes, parameters.
- Category:Isolators/Isolated Gate Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.295", 7.50mm Width)
- Technology:Capacitive Coupling
- Approval Agency:VDE
- Number of Channels:1
- Supplier Device Package:16-SOIC
- Current - Output High, Low:10A, 10A
- Voltage - Isolation:5700Vrms
- Current - Peak Output:10A
- Rise / Fall Time ( Typ):33ns, 27ns
- Common Mode Transient Immunity ( Min):150V/ns
- Propagation Delay tp L H / tp H L ( Max):130ns, 130ns
- Pulse Width Distortion ( Max):30ns
- Voltage - Output Supply:13V ~ 33V
- Series:Automotive, AEC-Q100
- Packaging:Dasenic-Reel®
- Packaging:Cut Tape (CT)
- Packaging:Tape & Reel (TR)
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC21737QDWRQ1 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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