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Texas Instruments UCC12050DVE
Manufacturer # :UCC12050DVE
Manufacturer :Texas Instruments
Dasenic # :UCC12050DVE-DS
Datasheet : UCC12050DVE Datasheet
Customer # :
Description : DC DC CONVERTER 3.3V 5V 500MW
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In Stock: 15000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.2973
Total :$ 5.30
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UCC12050DVE information
Texas Instruments UCC12050DVE technical specifications, attributes, parameters.
- Category:Board-Mount Power Supplies/DC DC Converters
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (With Derating)
- Features:Remote On/Off
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.295", 7.50mm Width)
- Size / Dimension:0.41" L x 0.30" W x 0.10" H (10.3mm x 7.5mm x 2.7mm)
- Approval Agency:CQC, TUV, UL, VDE
- Type:Isolated Module
- Voltage - Input ( Max):5.5V
- Supplier Device Package:16-SOIC
- Power ( Watts):500 mW
- Number of Outputs:1
- Voltage - Isolation:5 kV
- Control Features:Enable, Active High
- Current - Output ( Max):140mA, 100mA
- Voltage - Input ( Min):4.5V
- Voltage - Output 1:3.3V, 5V
- Voltage - Output 2:-
- Voltage - Output 3:-
- Voltage - Output 4:-
- Efficiency:60%
- Standard Number:-
- Applications:ITE (Commercial), Laboratory, Medical
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC12050DVE provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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