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  • Texas Instruments UC3903J

    IC SUPERVISOR 4 CHANNEL 18CDIP
  • part number has RoHS
  • Mfr.Part # :UC3903J
  • Manufacturer :Texas Instruments
  • Dasenic # :UC3903J-DS
  • Datasheet :pdf download UC3903J Datasheet
  • Description : IC SUPERVISOR 4 CHANNEL 18CDIP
  • Package :-
  • Quantity :
    Unit Price : $ 0Total : $ 0.00
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
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In Stock: 78
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
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Texas Instruments UC3903J technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Supervisors
Product Status:Obsolete
Operating Temperature:0°C ~ 70°C (TA)
Mounting Type:Through Hole
Package / Case:18-CDIP (0.300", 7.62mm)
Type:Multi-Voltage Supervisor
Supplier Device Package:18-CDIP
Output:Open Drain or Open Collector
Reset:Active Low
Number of Voltages Monitored:4
Voltage - Threshold:Adjustable/Selectable
Reset Timeout:Adjustable/Selectable
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
US ECCN:EAR99
HTS US:8542.39.0001
REACH Status:Vendor is not defined
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
UC3903J provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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