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Texas Instruments UC1863J
Manufacturer # :UC1863J
Manufacturer :Texas Instruments
Dasenic # :UC1863J-DS
Datasheet : UC1863J Datasheet
Customer # :
Description : RESONANT-MODE PWR SUPPLY CONTS
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In Stock: 1525
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 19.71
Total :$ 19.71
Delivery :
Payment :
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UC1863J information
Texas Instruments UC1863J technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Power Supply Controllers, Monitors
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C (TA)
- Mounting Type:Through Hole
- Package / Case:16-CDIP (0.300", 7.62mm)
- Current - Supply:150 µA
- Voltage - Input:-
- Supplier Device Package:16-CDIP
- Voltage - Supply:22V
- Applications:Resonant Converter Controller
- EU RoHS Status:RoHS non-compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UC1863J provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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