Name: TXS0104EZXUR
Brand: Texas Instruments
SKU: DS-5966221
Price: 0.6363 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Texas Instruments TXS0104EZXUR

IC TRNSLTR BIDIRECTIONAL 12BGA

Manufacturer # :TXS0104EZXUR

Manufacturer :Texas Instruments

Dasenic # :TXS0104EZXUR-DS

Datasheet :

TXS0104EZXUR Datasheet

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Description : IC TRNSLTR BIDIRECTIONAL 12BGA

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Quantity	Unit Price	Total
75+	$ 0.6363	$ 47.72
175+	$ 0.5220	$ 91.35
270+	$ 0.5058	$ 136.57
370+	$ 0.4896	$ 181.15
480+	$ 0.4734	$ 227.23

In Stock: 28985

MOQ :1 PCS

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Unit Price :$ 0.6363

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TXS0104EZXUR information

Texas Instruments TXS0104EZXUR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Logic - Translators, Level Shifters
Product Status:Obsolete
Operating Temperature:-40°C ~ 85°C (TA)
Features:Auto-Direction Sensing
Mounting Type:Surface Mount
Package / Case:12-UFBGA
Output Type:Open Drain, Push-Pull
Supplier Device Package:12-BGA Microstar Junior (2.5x2)
Number of Circuits:1
Data Rate:24Mbps
Input Signal:-
Output Signal:-
Translator Type:Voltage Level
Channel Type:Bidirectional
Channels per Circuit:4
Voltage - V C C A:1.65 V ~ 3.6 V
Voltage - V C C B:2.3 V ~ 5.5 V
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Texas Instruments TXS0104EZXUR
Datasheet:
TXS0104EZXUR,

Texas Instruments TXS0104EZXUR Environmental and export classification status description
The TXS0104EZXUR is a bi-directional voltage-level translator for applications involving mixed voltage systems, typically working between 1.2V to 5.5V. It allows for the translation of signals from one voltage domain to another, making it highly useful in systems where multiple voltage levels are present. Functions - Voltage Level Translation: It can translate digital signal levels between two different voltages, enhancing interoperability. - Bi-Directional Data Transfer: Supports bi-directional data flow, which is essential for I2C, UART, or SPI communication where devices may operate at different voltages. - Automatic Direction Sensing: The device automatically senses the direction of the signal and translates it accordingly. - Low Input Capacitance: Allows for high-speed signal translation with low latency. Applications - I2C and SPI Interfaces: Used for interfacing microcontrollers with sensors or other peripherals that operate at different voltage levels. - Interfacing Different Logic Families: Helpful in applications where devices belonging to different logic families need to communicate. - Consumer Electronics: Commonly used in smartphones, tablets, and other portable devices where multiple voltage levels are utilized. - Embedded Systems: Used in various embedded applications requiring level shifting to accommodate various standards. Alternative Parts - TXS0102 (2-Ch Level Translator): Similar function but with fewer channels. - TXB0104 (4-Ch Bi-Directional Level Shifter): Another option with different performance characteristics. - AO3400 (MOSFET based solution):

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TXS0104EZXUR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.