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Texas Instruments TWL1103GQER
Manufacturer # :TWL1103GQER
Manufacturer :Texas Instruments
Dasenic # :TWL1103GQER-DS
Datasheet : TWL1103GQER Datasheet
Customer # :
Description : IC AUDIO SIGNAL PROCESSOR 80BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 15000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.034
Total :$ 2.03
Delivery :
Payment :
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TWL1103GQER information
Texas Instruments TWL1103GQER technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Audio Special Purpose
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:80-VFBGA
- Number of Channels:1
- Interface:I²C
- Specifications:-
- Supplier Device Package:80-BGA MICROSTAR JUNIOR (5x5)
- Voltage - Supply:2.7V ~ 3.3V
- Applications:Consumer Audio
- Function:Audio Signal Processor
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TWL1103GQER provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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