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Texas Instruments TUSB546-DCIRNQR
Manufacturer # :TUSB546-DCIRNQR
Manufacturer :Texas Instruments
Dasenic # :TUSB546-DCIRNQR-DS
Datasheet : TUSB546-DCIRNQR Datasheet
Customer # :
Description : IC REDRIVER USB TYPE C 40-WQFN
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In Stock: 42392
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.5434
Total :$ 2.54
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TUSB546-DCIRNQR information
Texas Instruments TUSB546-DCIRNQR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Signal Buffers, Repeaters, Splitters
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:40-WFQFN Exposed Pad
- Current - Supply:-
- Type:Buffer, ReDriver
- Number of Channels:2
- Supplier Device Package:40-WQFN (6x4)
- Data Rate ( Max):8.1Gbps
- Output:-
- Voltage - Supply:3V ~ 3.6V
- Input:-
- Delay Time:-
- Signal Conditioning:Input Equalization, Output De-Emphasis
- Capacitance - Input:10 pF
- Applications:USB
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TUSB546-DCIRNQR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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