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Texas Instruments TSC2301IZQZR
Manufacturer # :TSC2301IZQZR
Manufacturer :Texas Instruments
Dasenic # :TSC2301IZQZR-DS
Datasheet : TSC2301IZQZR Datasheet
Customer # :
Description : IC SCREEN CNTRL 12BIT 120BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 24289
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.445
Total :$ 5.45
Delivery :
Payment :
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TSC2301IZQZR information
Texas Instruments TSC2301IZQZR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Touch Screen Controllers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:120-VFBGA
- Current - Supply:-
- Interface:SPI
- Supplier Device Package:120-BGA Microstar Junior (6x6)
- Touchscreen:4 Wire Resistive
- Voltage - Supply:2.7V ~ 3.6V
- Resolution ( Bits):12 b
- Voltage Reference:External, Internal
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TSC2301IZQZR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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