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Texas Instruments TSB12LV32TPZEP
IC GP LINK LAYER CTRLR 100LQFP
Manufacturer # :TSB12LV32TPZEP
Manufacturer :Texas Instruments
Dasenic # :TSB12LV32TPZEP-DS
Datasheet :
TSB12LV32TPZEP Datasheet
TSB12LV32TPZEP DatasheetCustomer # :
Description : IC GP LINK LAYER CTRLR 100LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 26.0640 | $ 26.06 |
| 10+ | $ 21.0447 | $ 210.45 |
| 25+ | $ 26.0640 | $ 651.6 |
| 90+ | $ 18.5002 | $ 1665.02 |
| 270+ | $ 17.7089 | $ 4781.4 |
In Stock: 4542
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 26.064
Total :$ 26.06
Delivery :
Payment :
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TSB12LV32TPZEP information
Texas Instruments TSB12LV32TPZEP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Controllers
- Product Status:Not For New Designs
- Operating Temperature:-40°C ~ 105°C
- Package / Case:100-LQFP
- Current - Supply:-
- Interface:Parallel
- Supplier Device Package:100-LQFP (14x14)
- Standards:IEEE 1394-1995, 1394a-2000
- Voltage - Supply:3.3V
- Protocol:IEEE 1394
- Function:Link Layer Controller
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TSB12LV32TPZEP provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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