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Texas Instruments TS3USB221RSER
Manufacturer # :TS3USB221RSER
Manufacturer :Texas Instruments
Dasenic # :TS3USB221RSER-DS
Datasheet : TS3USB221RSER Datasheet
Customer # :
Description : IC USB SWITCH DUAL 1X2 10UQFN
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In Stock: 8357
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.1554
Total :$ 0.16
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TS3USB221RSER information
Texas Instruments TS3USB221RSER technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Analog Switches - Special Purpose
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Bi-Directional, USB 2.0
- Mounting Type:Surface Mount
- Package / Case:10-UFQFN
- Number of Channels:2
- Supplier Device Package:10-UQFN (2.0x1.5)
- Multiplexer/ Demultiplexer Circuit:2:1
- Switch Circuit:SPDT
- On- State Resistance ( Max):6Ohm
- Voltage - Supply, Single ( V+):2.3V ~ 3.6V
- Voltage - Supply, Dual ( V±):-
- -3db Bandwidth:1.1GHz
- Applications:USB
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TS3USB221RSER provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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