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Texas Instruments TS3L100DGVR
Manufacturer # :TS3L100DGVR
Manufacturer :Texas Instruments
Dasenic # :TS3L100DGVR-DS
Datasheet : TS3L100DGVR Datasheet
Customer # :
Description : IC ETHERNET SWITCH QUAD 16TVSOP
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In Stock: 10500
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.945
Total :$ 0.94
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TS3L100DGVR information
Texas Instruments TS3L100DGVR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Analog Switches - Special Purpose
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Features:10/100 Base-T
- Mounting Type:Surface Mount
- Package / Case:16-TFSOP (0.173", 4.40mm Width)
- Number of Channels:4
- Supplier Device Package:16-TVSOP
- Multiplexer/ Demultiplexer Circuit:2:1
- Switch Circuit:SPDT
- On- State Resistance ( Max):15Ohm
- Voltage - Supply, Single ( V+):3V ~ 3.6V
- Voltage - Supply, Dual ( V±):-
- -3db Bandwidth:350MHz
- Applications:Networking
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TS3L100DGVR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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