Name: TRF7903PWG4
Brand: Texas Instruments
SKU: DS-8586362
Price: 1.989 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Texas Instruments TRF7903PWG4

TRF7903PWG4

Manufacturer # :TRF7903PWG4

Manufacturer :Texas Instruments

Dasenic # :TRF7903PWG4-DS

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TRF7903PWG4 Datasheet

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Description : TRF7903PWG4

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Quantity	Unit Price	Total
1+	$ 1.9890	$ 1.99

In Stock: 20

MOQ :1 PCS

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Shipping Origin :Shenzhen or Hong Kong Warehouse

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Unit Price :$ 1.989

Total :$ 1.99

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TRF7903PWG4 information

Texas Instruments TRF7903PWG4 technical specifications, attributes, parameters.
Category:RF and Wireless/RF Receivers
Product Status:Obsolete
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Antenna Connector:-
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EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Texas Instruments TRF7903PWG4
Datasheet:
TRF7903PWG4,

Texas Instruments TRF7903PWG4 Environmental and export classification status description
The Texas Instruments TRF7903PWG4 is an integrated analog front-end (AFE) device designed for contactless communication systems operating at 13.56 MHz. It is optimized for Near Field Communication (NFC) applications and offers advanced features for reliable and efficient communication. Functions: 1. Demodulation and decoding of 13.56 MHz signals 2. Reader/writer capabilities for NFC applications 3. Supports various NFC standards including ISO/IEC 14443 Type A and Type B, ISO/IEC 18092 (NFCIP-1), and FeliCa Applications: 1. NFC-enabled mobile phones, tablets, and wearable devices 2. Payment terminals and point-of-sale systems 3. Access control systems 4. Smart city infrastructure 5. Asset tracking and inventory management Alternative Components: 1. NXP PN512: An NFC frontend IC with a similar feature set 2. STMicroelectronics ST25R3911B: High-performance NFC/RFID reader IC 3. AMS AS3923: Analog front-end for NFC applications Embedded Modules: The TRF7903PWG4 can be integrated into modules designed for specific applications, offering a compact and efficient solution for NFC-enabled devices. Related Q&A: 1. Q: Can the Texas Instruments TRF7903PWG4 be used for wireless charging applications? A: No, the TRF7903PWG4 is specifically designed for NFC communication at 13.56 MHz and is not suitable for wireless charging. 2. Q: What is the power consumption of the TRF7903PWG4 in active mode? A: The power consumption in active mode typically ranges from a few milliwatts to a few watts, depending on the specific application and operating conditions. 3. Q: Is the TRF7903PWG4 compliant with relevant NFC standards? A: Yes, the TRF7903PWG4 is compliant with ISO/IEC 14443 Type A and Type B, ISO/IEC 18092 (NFCIP-1), and FeliCa standards for NFC communication. 4. Q: Can the TRF7903PWG4 be used in battery-operated devices? A: Yes, the TRF7903PWG4 is designed for low-power applications and can be used in battery-operated devices such as NFC-enabled mobile phones and wearables. 5. Q: Are there evaluation kits available for the TRF7903PWG4 for prototyping purposes? A: Yes, Texas Instruments offers evaluation kits and development tools to help customers prototype and test their NFC-enabled systems using the TRF7903PWG4.

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TRF7903PWG4 provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.