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  • Texas Instruments TRF7900APWG4

    RF RECEIVER FM/FSK 27MHZ 28TSSOP
  • part number has RoHS
  • Mfr.Part # :TRF7900APWG4
  • Manufacturer :Texas Instruments
  • Dasenic # :TRF7900APWG4-DS
  • Datasheet :pdf download TRF7900APWG4 Datasheet
  • Description : RF RECEIVER FM/FSK 27MHZ 28TSSOP
  • Package :-
  • Quantity :
    Unit Price : $ 5.1084Total : $ 5.11
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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In Stock: 20
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 5.1084$ 5.11

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Texas Instruments TRF7900APWG4 technical specifications, attributes, parameters.
Category:RF and Wireless/RF Receivers
Product Status:Obsolete
Operating Temperature:-40°C ~ 85°C
Features:RSSI Equipped
Mounting Type:Surface Mount
Package / Case:28-TSSOP (0.173", 4.40mm Width)
Frequency:27MHz
Sensitivity:-102dBm
Supplier Device Package:28-TSSOP
Data Rate ( Max):5kbps
Memory Size:-
Voltage - Supply:4V ~ 5.5V
Data Interface:PCB, Surface Mount
Modulation or Protocol:FM, FSK
Current - Receiving:65mA
Antenna Connector:PCB, Surface Mount
Applications:Human-Interface Devices (HID), Wireless Control
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TRF7900APWG4 provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.

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