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Texas Instruments TRF372017IRGZR

RF MODULATOR 300MHZ-4.8GHZ 48QFN
part number has RoHS
Manufacturer # :TRF372017IRGZR
Manufacturer :Texas Instruments
Dasenic # :TRF372017IRGZR-DS
Customer # :
Description : RF MODULATOR 300MHZ-4.8GHZ 48QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 25.5283$ 255.28
2500+$ 14.1824$ 35456
In Stock: 2513
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 25.5283
Total :$ 25.53
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TRF372017IRGZR information

  • Texas Instruments TRF372017IRGZR technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Modulators
  • Product Status:Active
  • Package / Case:48-VFQFN Exposed Pad
  • Current - Supply:200 mA
  • Output Power:3dBm
  • Voltage - Supply:3V ~ 3.6V, 4.5V ~ 5.5V
  • P1d B:12dBm
  • Test Frequency:2.7GHz
  • L O Frequency:300MHz ~ 4.8GHz
  • R F Frequency:300MHz ~ 4.8GHz
  • Noise Floor:-153dBm/Hz
  • Function:Upconverter
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TRF372017IRGZR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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