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Texas Instruments TPSM828221SILR
Manufacturer # :TPSM828221SILR
Manufacturer :Texas Instruments
Dasenic # :TPSM828221SILR-DS
Datasheet : TPSM828221SILR Datasheet
Customer # :
Description : 5.5-V INPUT, 2-A STEP-DOWN MODUL
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 8490
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.475
Total :$ 2.48
Delivery :
Payment :
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TPSM828221SILR information
Texas Instruments TPSM828221SILR technical specifications, attributes, parameters.
- Category:Board-Mount Power Supplies/DC DC Converters
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Features:Remote On/Off
- Mounting Type:Surface Mount
- Package / Case:10-TFDFN Module
- Size / Dimension:0.10" L x 0.08" W x 0.04" H (2.5mm x 2.0mm x 1.1mm)
- Approval Agency:-
- Type:Non-Isolated PoL Module
- Voltage - Input ( Max):5.5V
- Supplier Device Package:10-uSIP (2.5x2)
- Power ( Watts):-
- Number of Outputs:1
- Voltage - Isolation:-
- Control Features:-
- Current - Output ( Max):2A
- Voltage - Input ( Min):2.4V
- Voltage - Output 1:1.2V
- Voltage - Output 2:-
- Voltage - Output 3:-
- Voltage - Output 4:-
- Efficiency:95%
- Standard Number:-
- Applications:ITE (Commercial)
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TPSM828221SILR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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