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Texas Instruments TPS74701DRCR-P
IC REG
Manufacturer # :TPS74701DRCR-P
Manufacturer :Texas Instruments
Dasenic # :TPS74701DRCR-P-DS
Datasheet :
TPS74701DRCR-P Datasheet
TPS74701DRCR-P DatasheetCustomer # :
Description : IC REG
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| Quantity | Unit Price | Total |
In Stock: 33
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
Total :$ 0.00
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TPS74701DRCR-P information
Texas Instruments TPS74701DRCR-P technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - Linear
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:10-VFDFN Exposed Pad
- Output Type:Adjustable
- Voltage - Input ( Max):5.5V
- Supplier Device Package:10-VSON (3x3)
- Current - Output:500mA
- Current - Quiescent ( Iq):2 mA
- Control Features:Current Limit, Enable, Power Good, Soft Start
- Output Configuration:Positive
- Voltage - Output ( Min/ Fixed):0.8V
- Voltage - Output ( Max):3.6V
- Number of Regulators:1
- Voltage Dropout ( Max):0.12V @ 500mA
- P S R R:60dB ~ 30dB (1kHz ~ 300kHz)
- Protection Features:Over Current, Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
- Packaging:Bulk
- EU RoHS Status:ROHS3 Compliant
- REACH Status:REACH Unaffected
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TPS74701DRCR-P provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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