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Texas Instruments TPS61162YFFR
Manufacturer # :TPS61162YFFR
Manufacturer :Texas Instruments
Dasenic # :TPS61162YFFR-DS
Datasheet : TPS61162YFFR Datasheet
Customer # :
Description : IC LED DRIVER RGLTR DIM 9DSBGA
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In Stock: 2640
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.3421
Total :$ 3.34
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TPS61162YFFR information
Texas Instruments TPS61162YFFR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - LED Drivers
- Product Status:Discontinued at Digi-Key
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:9-UFBGA, DSBGA
- Frequency:1.2MHz
- Type:DC DC Regulator
- Supplier Device Package:9-DSBGA
- Internal Switch(s):Yes
- Voltage - Output:2.7V ~ 27V
- Current - Output / Channel:30mA
- Number of Outputs:2
- Topology:Step-Up (Boost)
- Voltage - Supply ( Max):6.5V
- Voltage - Supply ( Min):2.7V
- Dimming:Analog, PWM
- Applications:Backlight
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TPS61162YFFR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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