Name: TPS2370DR
Brand: Texas Instruments
SKU: DS-5731077
Price: 1.989 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Texas Instruments TPS2370DR

IC INTERFACE SPECIALIZED 8SOIC

Manufacturer # :TPS2370DR

Manufacturer :Texas Instruments

Dasenic # :TPS2370DR-DS

Datasheet :

TPS2370DR Datasheet

Customer # :

Customer #

Description : IC INTERFACE SPECIALIZED 8SOIC

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Quantity	Unit Price	Total
1+	$ 1.9890	$ 1.99
25+	$ 1.9530	$ 48.83
100+	$ 1.8720	$ 187.2
500+	$ 1.7910	$ 895.5
1000+	$ 1.6920	$ 1692

In Stock: 24000

MOQ :1 PCS

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Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 1.989

Total :$ 1.99

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TPS2370DR information

Texas Instruments TPS2370DR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Interface - Specialized
Product Status:Obsolete
Mounting Type:Surface Mount
Package / Case:8-SOIC (0.154", 3.90mm Width)
Interface:IEEE 802.3af
Supplier Device Package:8-SOIC
Voltage - Supply:-
Applications:Power Interface Switch for Power Over Ethernet (PoE) Devices
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Texas Instruments TPS2370DR
Datasheet:
TPS2370DR,

Texas Instruments TPS2370DR Environmental and export classification status description
The Texas Instruments TPS2370DR is a power-over-ethernet (PoE) controller that is commonly used in networking equipment, security cameras, access control systems, and other devices powered by an Ethernet cable. It is a high-efficiency, IEEE 802.3af-compliant device that integrates the necessary functions for a powered device (PD) to receive power safely over an Ethernet network. Functions: - PoE Power Sourcing Equipment (PSE) interface compatibility - Detection, classification, and current limit functions - Flexible power-mosfet driver - Advanced power management features - Thermal shutdown and overload protection Applications: - Networking equipment - Security cameras - Access control systems - VoIP phones - Wireless access points Alternative Components: - Maxim MAX5941 - Microchip Technology PD69104 - Linear Technology LTC4265 Embedded Modules: - Networking modules - Security camera modules - Access control modules 3 to 5 Related Q&A: 1. What is the maximum power delivery capability of the TPS2370DR? - The TPS2370DR is capable of delivering up to 13W of power to the powered device. 2. How does the TPS2370DR handle device classification in a PoE system? - The TPS2370DR uses a proprietary classification algorithm to detect the power requirements of the connected device. 3. Can the TPS2370DR be used in industrial applications? - Yes, the TPS2370DR is suitable for industrial environments and can be used in various industrial applications requiring PoE functionality. 4. Does the TPS2370DR support remote power cycling of connected devices? - While the TPS2370DR itself does not provide remote power cycling functionality, it can be integrated into systems that offer this feature. 5. What are the key advantages of using the TPS2370DR in a PoE application? - The TPS2370DR offers high efficiency, advanced power management features, and robust protection mechanisms, making it a reliable choice for PoE implementations.

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TPS2370DR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.