Name: TPS2330IDR
Brand: Texas Instruments
SKU: DS-6138815
Price: 6.3 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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1 : $6.3000

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Texas Instruments TPS2330IDR

IC HOT SWAP CTRLR GP 14SOIC

Manufacturer # :TPS2330IDR

Manufacturer :Texas Instruments

Dasenic # :TPS2330IDR-DS

Datasheet :

TPS2330IDR Datasheet

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Description : IC HOT SWAP CTRLR GP 14SOIC

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Quantity	Unit Price	Total
1+	$ 6.3000	$ 6.3

In Stock: 1492

MOQ :1 PCS

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Unit Price :$ 6.3

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TPS2330IDR information

Texas Instruments TPS2330IDR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
Product Status:Active
Operating Temperature:-40°C ~ 85°C
Features:Latched Fault, UVLO
Mounting Type:Surface Mount
Package / Case:14-SOIC (0.154", 3.90mm Width)
Current - Supply:500 µA
Type:Hot Swap Controller
Number of Channels:1
Supplier Device Package:14-SOIC
Internal Switch(s):No
Voltage - Supply:3V ~ 13V
Programmable Features:Circuit Breaker, Fault Timeout, Slew Rate
Current - Output ( Max):-
Applications:General Purpose
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Texas Instruments TPS2330IDR
Datasheet:
TPS2330IDR,

Texas Instruments TPS2330IDR Environmental and export classification status description
- Manufacturer: Texas Instruments - Part Number: TPS2330IDR - Category: Integrated Circuits (ICs) - Description: High-performance Power Management IC Functions: - Built-in Functions: - Integrated FET and control circuitry for synchronous buck power conversion - Input voltage up to 17V - Output current up to 3A - Programmable output voltage - Overcurrent protection - Thermal shutdown protection - Adjustable soft star-up Applications: - Power-Supply Systems: - Point-of-Load (POL) Converters - Servers and Data Centers - Networking Equipment - Industrial and Automation Systems Alternative Components: - Alternative ICs from Texas Instruments: - TPS548B22 - TPS546D24A - Alternative ICs from Other Manufacturers: - LT8609 - LMZM23600 Embedded Modules: - Embedded Features: - Built-in FETs for power conversion - Small form factor - Thermal and Overcurrent protection - Programmable voltage output Related Q&A: 1. Q: What is the maximum input voltage supported by the TPS2330IDR? A: The TPS2330IDR supports an input voltage of up to 17V. 2. Q: Can the output voltage be programmed in the TPS2330IDR? A: Yes, the TPS2330IDR has a programmable output voltage feature. 3. Q: What kind of protection features does the TPS2330IDR offer? A: The IC provides overcurrent protection and thermal shutdown protection. 4. Q: What are the typical applications of the TPS2330IDR? A: The TPS2330IDR is commonly used in power-supply systems for servers, data centers, and networking equipment. 5. Q: Are there alternative components available for the TPS2330IDR? A: Yes, alternative ICs from Texas Instruments like TPS548B22 and TPS546D24A, and from other manufacturers like LT8609 and LMZM23600 can be considered as alternatives.

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TPS2330IDR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.