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Texas Instruments TPS22949ADRGR
Manufacturer # :TPS22949ADRGR
Manufacturer :Texas Instruments
Dasenic # :TPS22949ADRGR-DS
Datasheet : TPS22949ADRGR Datasheet
Customer # :
Description : 4.5-V, 0.1-A, 350-mΩ, load switch with current limit and LDO
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In Stock: 9425
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.6962
Total :$ 0.70
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TPS22949ADRGR information
Texas Instruments TPS22949ADRGR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Power Distribution Switches, Load Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C (TJ)
- Features:Auto Restart, Load Discharge
- Mounting Type:Surface Mount
- Package / Case:8-WFDFN Exposed Pad
- Input Type:Non-Inverting
- Output Type:P-Channel
- Interface:On/Off
- Supplier Device Package:8-SON (3x3)
- Ratio - Input: Output:1:1
- Voltage - Supply ( Vcc/ Vdd):Not Required
- Number of Outputs:2
- Fault Protection:Current Limiting (Fixed), Over Temperature
- Output Configuration:High Side
- Rds On ( Typ):400mOhm
- Voltage - Load:1.62V ~ 4.5V
- Current - Output ( Max):100mA
- Switch Type:General Purpose
- Base Product Number:TPS22949
- Packaging:Dasenic-Reel®
- Packaging:Cut Tape (CT)
- Packaging:Tape & Reel (TR)
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TPS22949ADRGR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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