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Texas Instruments TPS2124YFPR
Manufacturer # :TPS2124YFPR
Manufacturer :Texas Instruments
Dasenic # :TPS2124YFPR-DS
Datasheet : TPS2124YFPR Datasheet
Customer # :
Description : IC POWER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 13098
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.548
Total :$ 1.55
Delivery :
Payment :
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TPS2124YFPR information
Texas Instruments TPS2124YFPR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Power Management - Specialized
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:20-XFBGA, DSBGA
- Current - Supply:300µA
- Supplier Device Package:20-DSBGA
- Voltage - Supply:2.8V ~ 22V
- Applications:General Purpose
- EU RoHS Status:Vendor omitted MSL Rating information
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TPS2124YFPR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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