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Texas Instruments TPA6139A2RGTT
Manufacturer # :TPA6139A2RGTT
Manufacturer :Texas Instruments
Dasenic # :TPA6139A2RGTT-DS
Datasheet : TPA6139A2RGTT Datasheet
Customer # :
Description : IC AMP CLASS AB STER 25MW 16QFN
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In Stock: 6000
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.6535
Total :$ 0.65
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TPA6139A2RGTT information
Texas Instruments TPA6139A2RGTT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Depop, Mute, Short-Circuit and Thermal Protection
- Mounting Type:Surface Mount
- Package / Case:16-VFQFN Exposed Pad
- Type:Class AB
- Output Type:Headphones, 2-Channel (Stereo)
- Supplier Device Package:16-VQFN (3x3)
- Voltage - Supply:3V ~ 3.6V
- Max Output Power x Channels @ Load:25mW x 2 @ 32Ohm
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TPA6139A2RGTT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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