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Texas Instruments TPA3245DDV
Manufacturer # :TPA3245DDV
Manufacturer :Texas Instruments
Dasenic # :TPA3245DDV-DS
Datasheet : TPA3245DDV Datasheet
Customer # :
Description : IC AMP CLSS D STER 115W 44HTSSOP
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In Stock: 1605
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.029
Total :$ 7.03
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TPA3245DDV information
Texas Instruments TPA3245DDV technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Features:Depop, Short-Circuit and Thermal Protection
- Mounting Type:Surface Mount
- Package / Case:44-TSSOP (0.244", 6.20mm Width) Exposed Pad
- Type:Class D
- Output Type:2-Channel (Stereo)
- Supplier Device Package:44-HTSSOP
- Voltage - Supply:12V ~ 30V
- Max Output Power x Channels @ Load:115W x 2 @ 2Ohm, 230W x 1 @ 4Ohm
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TPA3245DDV provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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