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Texas Instruments TPA3126D2DADR
Manufacturer # :TPA3126D2DADR
Manufacturer :Texas Instruments
Dasenic # :TPA3126D2DADR-DS
Datasheet : TPA3126D2DADR Datasheet
Customer # :
Description : IC AMP CLASS D STER 50W 32HTSSOP
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In Stock: 9252
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.9743
Total :$ 0.97
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TPA3126D2DADR information
Texas Instruments TPA3126D2DADR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Depop, Mute, Short-Circuit and Thermal Protection, Shutdown
- Mounting Type:Surface Mount
- Package / Case:32-TSSOP (0.240", 6.10mm Width) Exposed Pad
- Type:Class D
- Output Type:2-Channel (Stereo)
- Supplier Device Package:32-HTSSOP
- Voltage - Supply:4.5V ~ 26V
- Max Output Power x Channels @ Load:50W x 2 @ 4Ohm
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TPA3126D2DADR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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