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Texas Instruments TPA302DR
Manufacturer # :TPA302DR
Manufacturer :Texas Instruments
Dasenic # :TPA302DR-DS
Datasheet : TPA302DR Datasheet
Customer # :
Description : IC AMP CLASS AB STER 300MW 8SOIC
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In Stock: 30614
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.359
Total :$ 1.36
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Payment :
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TPA302DR information
Texas Instruments TPA302DR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
- Product Status:Discontinued at Digi-Key
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Short-Circuit and Thermal Protection, Shutdown
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Type:Class AB
- Output Type:2-Channel (Stereo)
- Supplier Device Package:8-SOIC
- Voltage - Supply:2.7V ~ 5.5V
- Max Output Power x Channels @ Load:300mW x 2 @ 8Ohm
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TPA302DR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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