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Texas Instruments TPA2000D4DAPR
Manufacturer # :TPA2000D4DAPR
Manufacturer :Texas Instruments
Dasenic # :TPA2000D4DAPR-DS
Datasheet : TPA2000D4DAPR Datasheet
Customer # :
Description : IC AMP CLASS D STER 2W 32HTSSOP
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In Stock: 16800
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.394
Total :$ 2.39
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Payment :
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TPA2000D4DAPR information
Texas Instruments TPA2000D4DAPR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Depop, Differential Inputs, Shutdown
- Mounting Type:Surface Mount
- Package / Case:32-TSSOP (0.240", 6.10mm Width) Exposed Pad
- Type:Class D
- Output Type:2-Channel (Stereo) with Stereo Headphones
- Supplier Device Package:32-HTSSOP
- Voltage - Supply:3.7V ~ 5.5V
- Max Output Power x Channels @ Load:2W x 2 @ 4Ohm; 90mW x 2 @ 32Ohm
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TPA2000D4DAPR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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