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Texas Instruments TP3070V-G/63
IC INTERFAC PCM COMBO II 28-PLCC
Manufacturer # :TP3070V-G/63
Manufacturer :Texas Instruments
Dasenic # :TP3070V-G/63-DS
Datasheet :
TP3070V-G/63 Datasheet
TP3070V-G/63 DatasheetCustomer # :
Description : IC INTERFAC PCM COMBO II 28-PLCC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 17.1329 | $ 171.33 |
| 750+ | $ 14.2774 | $ 10708.05 |
| 1500+ | $ 12.4351 | $ 18652.65 |
In Stock: 2972
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.1329
Total :$ 17.13
Delivery :
Payment :
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TP3070V-G/63 information
Texas Instruments TP3070V-G/63 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - CODECs
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:28-LCC (J-Lead)
- Type:PCM, Filter
- Supplier Device Package:28-PLCC (11.51x11.51)
- Resolution ( Bits):-
- Data Interface:PCM Audio Interface
- Voltage - Supply, Analog:±5V
- Voltage - Supply, Digital:±5V
- Number of A D Cs / D A Cs:1 / 1
- Sigma Delta:No
- S/ N Ratio, A D Cs / D A Cs (db) Typ:-
- Dynamic Range, A D Cs / D A Cs (db) Typ:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TP3070V-G/63 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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